Morphological evolution of edge-hillocks on single-crystal films having anisotropic drift-diffusion under the capillary and electromigration forces
Yazarlar (3)
Tarik Omer Oğurtanı
Middle East Technical University (Metu), Türkiye
Dr. Öğr. Üyesi Aytaç ÇELİK Tobb Ekonomi ve Teknoloji Üniversitesi, Türkiye
Dr. Öğr. Üyesi Ersin Emre Ören Tobb Ekonomi ve Teknoloji Üniversitesi, Türkiye
Makale Türü Özgün Makale (SSCI, AHCI, SCI, SCI-Exp dergilerinde yayınlanan tam makale)
Dergi Adı Thin Solid Films (Q1)
Dergi ISSN 0040-6090 Dergi Bilgileri (2007)
Dergi Tarandığı Indeksler SCI-Expanded
Makale Dili İngilizce Basım Tarihi 01-2007
Cilt / Sayı / Sayfa 515 / 5 / 2974–2983 DOI 10.1016/j.tsf.2006.08.020
Makale Linki https://doi.org/10.1016/j.tsf.2006.08.020
UAK Araştırma Alanları
Fiziksel Metalurji
Özet
The morphological evolution of hillocks at the unpassivated sidewalls of single-crystal metallic thin film interconnects is investigated via computer simulations using the free-moving boundary value problem. The effect of drift-diffusion anisotropy on the development of surface topographical scenarios is fully explored under the action of electromigration and capillary forces, utilizing numerous combinations of the surface texture, the drift-diffusion anisotropy and the direction of the applied electric field. The simulation studies yield analytical relationships for the velocity of the surface solitary waves and the drift velocity of electromigration-induced internal voids as a function of the applied current densities, which contain intrinsic and structural properties of the single-crystal thin films. The threshold value of the applied current density, above which electromigration-induced internal voids can be formed and may cause the …
Anahtar Kelimeler
edge hillocks | elecktromigration