Investigation of electromigration induced hillock and edge void dynamics on the interconnect surface by computer simulation
Yazarlar (1)
| Makale Türü |
Özgün Makale
(Uluslararası alan indekslerindeki dergilerde yayınlanan tam makale)
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| Dergi Adı | PQDT-Global | ||
| Makale Dili | – | Basım Tarihi | 01-2004 |
| Makale Linki | https://search.proquest.com/openview/5101e7e69cd27c11042259e36489947c/1?pq-origsite=gscholar&cbl=2026366&diss=y | ||
| UAK Araştırma Alanları |
Fiziksel Metalurji
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| Özet |
| The Electromigration-induced failure of metallic interconnects is a complicated process, which involves flux divergence, vacancy and atom accumulation with or without compositional variations, void and hillocks nucleation, growth and shape changes. |
| Anahtar Kelimeler |
