Investigation of electromigration and stress induced surface dynamics on the interconnect by computer simulation
Yazarlar (1)
| Makale Türü |
Özgün Makale
(Uluslararası alan indekslerindeki dergilerde yayınlanan tam makale)
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| Dergi Adı | PQDT-Global | ||
| Makale Dili | – | Basım Tarihi | 01-2011 |
| Makale Linki | https://search.proquest.com/openview/4afab8818d208552fee23618725bb987/1?pq-origsite=gscholar&cbl=2026366&diss=y | ||
| UAK Araştırma Alanları |
Fiziksel Metalurji
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| Özet |
| Purpose of this work is to provide a comprehensive picture of thin film (interconnect) and solid droplet surface evolution under the several external applied forces with anisotropic physical properties so that one can eventually be able to predict main reasons and conditions under which stability of surface is defined. |
| Anahtar Kelimeler |